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SMT加工维修技巧

Release Time:2022-03-07 Edit the author:威尼斯注册下载app-382017威尼斯登陆网站 Reading:497


手工焊接应遵循先小后大、先低后高的原则,将分类批量焊接,先焊片式电阻、片式电容、晶体管,再焊小型IC器件、大型IC器件,最后焊插件

焊接片式元件时,焊头的宽度应与元件的宽度相同。如果太小,组装焊接时不容易定位。当焊接像SOP、 QFP、 PLCC这样两面或四面都有引脚的器件时,需要在两

面或四面焊接几个定位点。仔细检查并确认每个引脚与相应的焊盘匹配后,可以通过拖动来焊接其余的引脚。焊接不要拖得太快,1 s左右拖一个焊点即可。焊接后,用4~6倍的放大镜检查焊点之间有无桥接。在有桥的地方,用刷子蘸一点焊剂,然后再进行拖拉焊接。同一部位的焊接不得连续超过2次。如果不是一次焊完,要冷却后再焊。在焊接IC器件时,在焊盘上均匀涂上一层锡膏,不仅可以渗透和帮助焊点,还可以大大方便维修工人的操作,提高维修速度。

成功修复的两个关键过程是焊前预热和焊后冷却。

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